Wire bond process tech

NXP SemiconductorsApplyPublished 2 days agoFirst seen 2 days ago
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Key Responsibilities:

1.Perform wire bond process task  on quality hold material

2.Collaborate with engineering to improve WB processes and techniques.

3.Assist in resolving WB-related issues to minimize production downtime.

Requirements:

1.Diploma or above in Engineering or a related field.

2.Working experience with WB process is preferable and recommended

3.Strong attention to detail and technical troubleshooting skills.

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