Sr Account Technical Executive II

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At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Key Responsibilities

  • Lead technical engagement for Digital IC/Custom IC / Analog / RF design flows, with a primary focus on Innovus and Virtuoso platforms along with signoff technologies
  • Partner with customer design and CAD teams to optimize layout productivity, quality, and time-to-market
  • Drive adoption of advanced capabilities such as:
    • Constraint-driven and automation-assisted layout
    • Device-level and full-chip layout methodologies
    • Advanced node layout challenges (FinFET, GAA)
    • EM and IR-aware layout and parasitic extraction flows
  • Champion the integration of AI-driven design techniques, including:
    • Agentic AI workflows to automate design exploration, layout optimization, and verification tasks
    • AI-assisted decision-making for layout trade-offs including PPA, matching, and parasitics
  • Translate customer pain points into actionable requirements for R&D and product engineering
  • Provide technical leadership in methodology definition, flow development, and best practices
  • Influence competitive replacements and expand footprint of Cadence Custom IC solutions
  • Support executive-level discussions by linking technical value such as PPA, productivity, and risk reduction to business outcomes

Key Qualifications

Digital IC

  • Deep hands-on experience with digital design flow including Genus/Innovus , Quantus , Tempus and Pegasus
    • Clear understanding of PPA tradeoff’s and other key concerns for design teams
    • Ability to think full stack/flow – interconnect technologies and drive value proposition
    • Experience working with design teams on large SOC tapeouts
    • Understanding of foundry working model and care bouts – knowledge of PDK enablement  , DTCO and technology entitlement a plus

Custom IC and Virtuoso Expertise

  • Deep hands-on experience with the Cadence Virtuoso Platform, including:
    • Virtuoso Layout Suite (XL, GXL, EXL)
    • Schematic-driven layout and LVS flows
    • DRC and physical verification integration
  • Strong knowledge of custom analog and mixed-signal layout techniques, including:
    • Device matching, symmetry, common centroid, and shielding
    • Parasitic-aware layout for high-performance analog and RF circuits
  • Experience with the Spectre simulation environment and layout-to-schematic integration
  • Familiarity with PCell development, layout automation, and scripting (SKILL preferred)

Agentic AI and Intelligent Design Automation

  • Strong understanding of AI and machine learning applications in semiconductor design, specifically:
    • Agentic AI frameworks such as multi-agent systems, goal-driven automation, and autonomous optimization
    • AI-assisted layout generation and design space exploration
    • Intelligent automation of repetitive design and verification tasks
  • Experience or demonstrated interest in:
    • Applying AI to EDA workflows, CAD flows, or design methodology optimization
    • Working with data-driven or reinforcement learning-based optimization approaches
  • Ability to bridge AI innovation with practical design flows, translating emerging technologies into deployable customer solutions

Design and Methodology Expertise

  • 5–10 or more years of experience in:
    • Custom IC, Analog, or RF design or layout engineering
    • Mixed-signal design flows at block and full-chip level
  • Deep understanding of:
    • Analog and RF design flows from schematic to signoff
    • Physical verification, extraction, and post-layout simulation
    • Advanced-node layout challenges and reliability considerations
  • Experience with layout productivity optimization and methodology deployment at scale

Customer Engagement and Leadership

  • Proven ability to:
    • Engage deeply with CAD teams, design leads, and senior technical leadership
    • Identify and articulate technical gaps and business impact
    • Drive alignment between customer roadmap and Cadence product direction
  • Strong communication skills with the ability to translate between deep technical detail and executive-level value

Position Requirements

  • BSEE required, MSEE or higher strongly preferred
  • 5–10 or more years of experience in  Digital IC , Custom IC, Analog, or RF design or layout
  • Demonstrated expertise in Innovus-based and  Virtuoso-based design environments
  • Exposure to or strong interest in AI-driven design methodologies and agent-based automation frameworks
  • Exposure to chiplet design flows , packaging and IP design a plus
  • Strong collaboration and customer-facing experience
  • Ability to travel approximately 25 percent, primarily within North America

The annual salary range for California is $248,000 to $372,000. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.

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