Senior Thermal-Mechanical Engineer — Aerospace Communications & Space Electronics

The Senior Thermal-Mechanical Engineer will play a crucial role in our team, leading the development and integration of aerospace and space communications equipment. With a primary focus on RF communications, this role involves designing thermal-mechanical solutions for high-performance electronics, including SpaceVPX/VITA-based systems. The successful candidate will have extensive experience in thermal management, structural analysis, and environmental qualification, ensuring our equipment meets the demanding requirements of aerospace and space environments.

Qualifications

• Bachelor's degree in Mechanical Engineering, Aerospace Engineering, or a related field is required.
• 7+ years of relevant thermal-mechanical or mechanical engineering experience, with a strong focus on aerospace or space applications.
• Expertise in thermal management of electronic, RF, and communications equipment is essential.
• Hands-on experience with SpaceVPX, VNX, and VPX architectures is highly desirable.
• Proficiency in FEA and thermal analysis tools, such as ANSYS or Abaqus, is a must.
• Demonstrated experience in TVAC, thermal cycling, shock, and vibration qualification testing.
• Strong understanding of mechanical packaging, GD&T, and manufacturing processes.
• Ability to work effectively in a multidisciplinary team, collaborating with RF, electrical, and systems engineers.
• Excellent problem-solving and analytical skills, with a track record of delivering complex engineering projects.
• U.S. Citizenship or Permanent Residency (Green Card) is strongly preferred, with authorization to work in the U.S.

Responsibilities

• Lead thermal-mechanical architecture and detailed design for aerospace communications equipment, with a focus on RF systems.
• Design thermal management solutions for high-power RF amplifiers, processors, and other high-density electronics.
• Develop mechanical packaging and thermal solutions for SpaceVPX and VNX-based systems, ensuring optimal performance and reliability.
• Perform thermal, structural, and thermo-mechanical analysis, including steady-state and transient thermal analysis, and modal analysis.
• Design and optimize heat sinks, cold plates, and thermal interface materials to enhance heat dissipation.
• Work closely with multidisciplinary engineering teams, including RF, electrical, and systems engineers, to ensure seamless integration.
• Lead and support TVAC, shock, and vibration qualification testing, ensuring our equipment meets the highest standards.
• Take ownership of hardware development, from concept to production, ensuring timely and successful project delivery.
• Mentor junior engineers and provide technical leadership, fostering a culture of continuous improvement.

Salary Range: $130,000 - $230,000 USD *Plus, potential incentive/variable compensation for eligible roles.