Packaging Engineer - HV GaN module
The Emerging Packaging Technologies at Texas Instruments is looking for a candidate for HV GaN module development engineer
Responsibilities:
- Design, develop, and characterize high voltage (200–1200V) packages and high-power modules targeting AI infrastructure and Industrial market
- Understand market trends and end equipment system requirements and translate these into package design specifications.
- Define packaging solutions across HV technologies including GaN, SiC, IGBT, and Isolation Technologies; validate designs using CAD, thermomechanical, and electrical parasitic extraction tools.
- Work with material suppliers (mold compounds, die attach, substrates) to qualify materials meeting HV application requirements.
- Collaborate with cross-functional teams across sites to support development and ramp of new products.
Qualifications
Minimum Qualifications:
- MS degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
- 5+ years of hands-on experience in high voltage (200V–1200V) or high-power semiconductor packaging across GaN, SiC, IGBT technologies.
- Hands-on experience with HV package and power module design, materials, and assembly flow integration (molded packages such as TOLT, TOLG, Q-DPAK, DIP, SIP and case modules).
- Familiarity with HV Bill of Materials including mold compounds, die attach, and DBC substrates.
- Experience with stress, thermal, and electrical parasitic modeling tools.
- Understanding of HV discrete and power module reliability and qualification requirements; ability to support qualification activities and contribute to problem solving.
- Good communication skills; able to work effectively with internal teams and external suppliers.
- Proficiency in English and Japanese.
- Prior experience supporting scale-up of HV packages or modules from prototype to volume manufacturing.
- Experience in presenting technical work at internal reviews or industry conferences
- Working knowledge of clip attach, flip chip packaging, and wafer bumping processes.
Preferred Qualifications:
- Prior experience supporting scale-up of HV packages or modules from prototype to volume manufacturing.
- Experience in presenting technical work at internal reviews or industry conferences
- Working knowledge of clip attach, flip chip packaging, and wafer bumping processes.
Why TI?
- Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
- We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
- Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.