ATYED Engineer (Package)

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

About ATYED(Advanced Technology Yield Excellence Division) – As an R&D Engineer in ATYED, your core mission will be driving technology development through advanced defect inspection and analysis. In this role, you will deeply understand advanced packaging processes (such as CoWoS, SoIC, etc.) to identify the root causes of issues. By leveraging cutting-edge inspection tools and developing innovative defect reduction methodologies, you will play a key role in enhancing detection capabilities and optimizing semiconductor technologies.

To help us get to know you better, please provide a brief self-introduction and your research areas. We look forward to learning more about your background and personal traits!

Job Responsibilities

1. Enhance Detection Capabilities: Leverage and optimize advanced inspection tools to detect and process defects across cutting-edge packaging technologies (including CoWoS, SoIC, etc.).

2. Analyze & Resolve: Deeply understand advanced packaging processes, analyze defect data, and identify root causes of issues to accelerate technology development.

3. Develop & Innovate: Research and develop innovative defect inspection methodologies to achieve effective defect reduction and yield enhancement.

4. Collaborate for Success: Partner with cross-functional R&D and process teams to implement solutions and drive continuous improvement.

Job Qualifications

1. Minimum Qualifications

(1) Education: Master’s degree or higher in Physics, Electrical Engineering, Photonics, Chemical Engineering, Materials i.Science, Mechanical Engineering, or a related engineering discipline.

(2) Required Skills & Knowledge:

i. Strong technical problem-solving and analytical skills based on fundamental scientific principles.

ii. Basic understanding of semiconductor physics, optics, or materials science

(3) Personal Attributes / Interpersonal Skills: A strong sense of ownership and a proactive, hands-on approach to tackling challenges.

2. Preferred Qualifications

(1) Experience or coursework in semiconductor packaging processes (e.g., TSV, wafer-level packaging, 3D IC).

(2) Hands-on experience with defect inspection or metrology tools (optical or electron-beam based).

#LI-DNI

TSMC Core Values

At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: 

• Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.
• Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. 
• Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. 
• Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term.

 (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values)Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.