Advanced Packaging BD Manager
Job Responsibilities
1. In-depth knowledge in advanced packaging / chip stacking technology, product, and market trend.
2. Develop 3DIC technology roadmap, business plan, strategy, and long-term demand forecast.
3. Identify and engage customers to grow new business.
4. Work with different organizations to enable 3DIC business and fulfill customer requirements.
5. Strengthen our infrastructure in business operations and deepen our influence in supply chain.
Job Qualifications
1. M.S. degree or above in engineering, 15 years and above of related experiences.
2. Experience in advance packaging design, technology development, process integration, product engineering, or quality and reliability is preferred.
3. Self-motivated, aggressive and interested in business development.
4. Proficient in both Chinese & English. Good verbal and written communication with logical thinking.
5. Proven capabilities in leading large-scale cross-team projects.
TSMC Core Values
At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work:- Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.
- Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees.
- Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice.
- Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term.

