Advanced Interconnect Lead, Quantum AI

As a Quantum Hardware Engineer for Advanced Interconnect Lead, you will manage the advanced interconnect team to solve our integration and interconnect issues. You will be responsible for realizing new technologies for integration of cryogenic microwave devices and superconducting quantum processors. You will collaborate with other researchers and engineers on the Quantum AI team, and external academic and industrial partners, to develop the integration technologies to be used in our next generation of quantum computers. You will also seek out and develop partnerships with vendors and other entities to advance our knowledge and capabilities to meet our quantum roadmap milestones.

You will use your experience in silicon, PCB, and MEMS technologies to manage multiple projects simultaneously. You will bring curiosity and engineering intuition to develop the understanding needed to improve superconducting quantum hardware system performance, and precision to pave the way for rapidly increasing the number of qubits in accordance with our roadmap.

The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.

Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $188000 - $274000 (USD) + 20% bonus target + equity + benefits

Learn more about benefits at Google.

Responsibilities

• Lead and manage our growing advanced interconnect technology team.
• Develop advanced integration and interconnect technologies for integrating cryogenic microwave devices and superconducting quantum components.
• Scope and purchase tools needed for development of integration technologies, including materials and processes, and determine the capabilities and limits of newly developed technologies.
• Collaborate with industrial and academic partners as a project technical lead for external technology development and implementation.
• Write documentation and transfer newly developed processes/technologies to in-house or external production.

Minimum qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
  
• 6 years of experience working with technology and process R&D in MEMS, PCB, or silicon technologies.
• 3 years of experience in technical leadership.
  

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
  
• Experience with a scripting or a programming language.
  
• Experience with materials and integration technologies for electronics in extreme environments.
• Microwave engineering experience.