【2027 TSMC RDSS&AO】Advanced Packaging Technology Development (APTD)

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Job Responsibilities

As a member of the APTD (Advanced Packaging Technology Development) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, COUPE and SoIC process/integration development for customer's variety applications.

1. Integration

(1) Develop advanced 3DIC (InFO, CoWoS, COUPE and SoIC) processes and sustain baseline.

(2) Package level reliability, failure mode analysis and improvement plan.

(3) Customer technical interface, new tape out and lot handle.

(4) Handover developed technologies to manufacturing groups for production.

2. Module Development

(1) Be responsible for CVD/PVD/CMP/Wet/Etch/Polymer/Bonding/Thinning/Joint/Saw/Trim/Material module development for 3DIC projects.

(2) New technology, materials survey, and process improvement on 3DIC package structures.

(3) Process development and tool transfer to mass-production development.

3. Simulation

(1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment.

(2) Practice FEM and DOE in problem solving and path finding particularly on packaging.

(3) Continue improvement in simulation methodology, material modeling and script automation.

Job Qualifications

1. Master's degree or above in Chemical Engineering, Material Science, Chemistry, Physics, Mechanical Engineering, or related fields in science or engineering.

2. Experience in TV design or IC packaging is a plus.

3. Good communication skills in Chinese and English.

4. Hands-on participation and a strong sense of ownership are required.

5. Strong technical problem-solving and analytical skills.

6. For simulation positions, mastery of FEM software such as Ansys, LS-DYNA, Abaqus and others.

#LI-DNI

TSMC Core Values

At TSMC, we invite talented individuals who share our vision and values to contribute to our continued success. Our core values are the foundation of our culture, guiding every decision and action. We seek applicants who deeply resonate with these principles and embody them in their work: 

• Integrity: Tell the truth. We do not brag. We do not make commitments lightly. Once we make a commitment, we devote ourselves completely to meeting that commitment.
• Commitment: Employees are dedicated to the company, view the company’s success as their own and work diligently to make their best contributions. As commitment is mutual, the Company strives to serve the best interests of its employees. 
• Innovation: Innovation is the wellspring of the Company's growth. It means more than new ideas; it means putting ideas into practice. 
• Customer Trust: We strive to build deep and enduring relationships with our customers, who trust and rely on us to be part of their success over the long term.

 (For more details on TSMC’s Core Values, please visit：https://www.tsmc.com/english/aboutTSMC/values)Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.