Structural Design and Analysis Engineer, Sensors
The TechEng sensing team is responsible for sensor technologies within all of our consumer devices (phone/watch/buds/home/tracker), including both hardware and algorithm development, representing a array of technologies such as inertial, magnetometer, barometer, Electrocardiogram (ECG), Photoplethysmogram (PPG), haptics, touch, fingerprint, and others. We maintain year-over-year performance of the sensors in our devices, along with developing innovative, never-before-seen technologies in the sensing space. Given the importance of sensors in understanding and feeding user context into the ML/AI/LLM, this is an incredibly exciting and dynamic space.
As a Structural Design and Analysis Engineer on the Tech Eng Sensors team, you will work alongside cross-functional hardware and software teams to solve unique mechanical design and sensor performance challenges to bring next-generation sensing innovation to life. You will use your creativity and range of engineering experience to explore solutions to a variety of engineering problems focused on how mechanical architecture statics and dynamics influence sensor functionality. As a mechanical engineer, you will participate in the design, analysis, and prototyping of new concepts. You will collaborate cross-functionally to solve problems and help optimize designs.Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
US: $159000 - $230000 (USD) + 15% bonus target + equity + benefits
Learn more about benefits at Google.
As a Structural Design and Analysis Engineer on the Tech Eng Sensors team, you will work alongside cross-functional hardware and software teams to solve unique mechanical design and sensor performance challenges to bring next-generation sensing innovation to life. You will use your creativity and range of engineering experience to explore solutions to a variety of engineering problems focused on how mechanical architecture statics and dynamics influence sensor functionality. As a mechanical engineer, you will participate in the design, analysis, and prototyping of new concepts. You will collaborate cross-functionally to solve problems and help optimize designs.Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
US: $159000 - $230000 (USD) + 15% bonus target + equity + benefits
Learn more about benefits at Google.
Responsibilities
- Build verified, calibrated, and validated finite element analysis (FEA) and analytical models for mechanical parts, modules, and assemblies.
- Conduct static, dynamic, and structural analyses to predict field failures, user interactions, and impacts on sensor functionality.
- Correlate simulation results with physical performance to drive early design optimization and solve complex failure issues.
- Explore, validate, and integrate materials, technologies, and simulation methods to advance team capabilities.
- Partner cross-functionally across product development cycles to create analysis plans, mitigate risks, and deliver data-driven solutions.
Minimum qualifications:
- Bachelor's degree in Mechanical Engineering or equivalent practical experience.
- 4 years of experience working in a structural mechanics and finite element analysis (FEA) simulation technical environment.
- 3 years of experience using simulation and design tools (e.g., Abaqus, Ansys Mechanical, Hypermesh, Siemens NX, Creo) as well as mechanical testing (including tensile, compression, shear, quasi-static, and dynamic).
Preferred qualifications:
- Master's degree or PhD in Mechanical Engineering.
- Industrial experience in complex material simulation for consumer electronics, as well as proficiency in scripting and automation (e.g., Python, APDL) for FEA workflows.
- Technical expertise in or more of the core areas of mechanical design, simulation, and testing, including static/dynamic structural FEA, non-linear and damage material mechanics, and physical testing protocols (tensile, compression, shear under quasi-static and dynamic conditions).