Memory Hardware Engineer

Lenovo•Apply•Published 6 months ago•First seen 2 hours ago

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Description and Requirements

Employer: Lenovo Japan, LLC

Work location: Minato-mirai (Yokohama-shi); (*3 onsite and 2 remote days in a week could be applicable)

Smoking: Not allowed in the office, but smoking room is available in 21st floor of Minato-mirai Center Building

Employment condition: Permanent Staff (Probation period: 6 months)

Expected salary: Depending on the current salary and experience, we would make our decision.

Discretionary labor system allowance: Applicable for Band 6 (50,000 JPY per a month)

Working hours: 9:00-17:45 (Rest time: 1 hour (12:00-13:00))

Holidays: Saturday, Sunday, national holidays, year-end holiday, established anniversary day, special holiday, and compensatory holiday

Social insurance and benefits: Comprised of Pension, Health, Unemployment and Worker's Accident Compensation, Defined-contribution pension, property accumulation savings, Lenovo employee group life insurance, etc.

■About Organization

Report to : Director, Memory & Power Technology
Subordinates : None
Number of Peers : 9

■Roles and responsibilities

Technical project management of Memory for ThinkPad
Communication interface to suppliers and Lenovo internal cross functional teams for related projects’ technical issues of memory
Creates test plan / report for memory qualification
Directs/review supplier & outsourcing vendor for qualification testing (approve/dispute results, etc.)
Performs pre-qualification testing, design review, and critical qualification tests
Directs defect analysis and problem resolution. Manage suppliers & outsourcing vendors to resolve issues and review/approve fix plan
Support Product Development to enable emerging memory technologies with technical expertise
Report Qualification Status. Make an organized presentation for technical details.

■Key Interaction with:

Development teams in Lenovo/NECPC Japan, Lenovo China, Lenovo US
System Development team (EE, ME, BIOS, SW)
Product Assurance team (PAPM, HWPA, SWPA)
Product Engineering team
Strategic Technology Innovation Center
Subsystem Development team
Worldwide Lenovo operation team
Memory Operations Team (GCM, GSM, SQE, Service)
Offering Core Team (PBM, TPM, Marketing)
Quality Team (PQE, MQE, PE, SQE)
Product planning team
Supplier Partners
Memory suppliers (Samsung, SK Hynix, Micron, CXMT, Kingston, Ramaxel)
CPU suppliers (Intel, AMD, Qualcomm, NV)
ODM partners (LCFC, Wistron, etc)
Outsourcing vendors

Requirements

Must Have – essential

3 years minimum experience in memory development especially qualifications or project management.
Basic knowledge of memory, PC hardware, CPU, motherboard, Bios.
Good project management skills
Good oral and written English skills
Ensure timely response and accurate communication
Proactive in deep analysis & improvement
Strong interest in creation & innovation

Good to have - desirable

Better to speak in Chinese and Japanese
Experience of memory design, testing, wafer manufacturing
Experience of memory and motherboard failure analysis
Experience of LLM, AIPC, memory signal testing, memory communication with XPU
Failure analysis skills
Organized English Presentation
Good negotiation skill

Typical Candidate

Memory development / qualification / testing engineer who ever worked in PC company, Device company for memory or ODM