Advanced Package Development Engineer

Summary

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products.
In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.

Description

Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development.

We're looking for someone who:

• Has deep expertise in semiconductor packaging or related disciplines
• Thrives on solving difficult technical problems
• Holds themselves to a high standard of engineering excellence
• Is self-motivated and comfortable navigating ambiguity

  Responsibilities

  • Develop and qualify advanced packaging technologies including substrate design, interconnect architectures, and assembly processes to meet performance, power, and form factor requirements for next-generation products.
  • Drive package integration across silicon, firmware, and system teams to ensure co-optimization of die architecture, package design, and thermal/mechanical constraints.
  • Lead characterization and failure analysis efforts to identify root causes of reliability or performance issues and implement corrective actions.
  • Partner with external suppliers and foundries to evaluate new materials and processes, establish specifications, and enable technology transfer to high-volume manufacturing.
  • Define and execute test vehicles and experiments to validate packaging concepts, establish design rules, and generate data for product design decisions.

  Minimum Qualifications

  • BS and 10+ years of experience in relevant industry experience.

  Preferred Qualifications

  • PhD and 6+ years of experience in relevant industry preferred.
  • Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc.
  • Deep knowledge of electrical, mechanical and thermal properties of fab materials.
  • Strong expertise in Si Fab equipment and Fab Logistics Management.
  • Experience on advanced packaging for groundbreaking CMOS nodes.
  • Expertise on Si structure yield and reliability mechanisms and analyses.
  • Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis.
  • Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT.
  • Capable of independent R&D Work in a cross-functional team, driving vendors.
  • Excellent communication skills.
  • Experience in Si fab integration role and advanced packaging.