3D Integration Engineer, Quantum AI

Our team is composed of researchers and engineers that focus on the research, development and deployment of superconducting quantum processors and related components. Our mission is to increase the scalability and performance of our systems at the hardware level, through microwave circuit design, materials science, microfabrication, and 3D integration techniques. This role offers the opportunity to impact a wide range of technology, requiring close collaboration across fabrication, packaging, and processor teams.

As a 3D Integration Engineer, you will support scaling and performance improvements in our flagship quantum processors. You will focus on DC and microwave measurement-driven test vehicle development, evaluating advanced 3D integration and packaging concepts, and generating insights that directly impact processor scalability, cross-section, and processor/package interfaces.

The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.

The US base salary range for this full-time position is $126,000-$181,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Work with research scientists and engineers to test samples to characterize superconducting devices, interconnects, and 3D integrated structures.
  
• Perform data analysis, failure analysis, and summarize results.
• Develop and maintain cryogenic measurement setups for quantum hardware testing.
• Interface between packaging, fabrication, and processor teams to coordinate experiments and resolve integration challenges.

Minimum qualifications:

• Bachelor's degree in science in Electrical Engineering, Applied Physics, Materials Science, related fields, or equivalent practical experience.

• Experience in interfacing with hardware and experiment execution.
• Experience with data analysis and data visualization.

Preferred qualifications:

• PhD in Physics, Engineering, a related field, or equivalent practical experience.
• Experience with microwave engineering, circuit design, or test-and-measurement equipment and practices, in the context of quantum or superconducting systems.
• Experience with 3D integration/Micro Electro Mechanical Systems (MEMS) and micro fabrication techniques and tools.
• Experience in collaborative software environments (e.g., version control, code review, style guides, etc.) building tools for other engineers and end-users.