Advanced Packaging Development Engineer, Quantum AI

As an Advanced Packaging Engineer, you will be a key contributor to the research and development of next-generation packaging platforms for superconducting quantum processors and associated components. You will focus on emerging packaging technologies essential for the scaling of quantum processors. You will pioneer and investigate packaging methods such as 2.5D/3D integration, advanced substrate materials, and novel interconnect technologies. You will collaborate closely with the quantum processor team, RF engineers, and external partners. Your goal will be to transition research concepts into deployable packaging solutions that enable the scaling roadmap of our quantum processors.The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.

The US base salary range for this full-time position is $147,000-$216,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.

Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.

Responsibilities

• Design and architect novel packaging platforms.
• Conduct Root Cause analysis and develop mitigation strategies for performance limiting factors (e.g., yield, reliability, signal loss) unique to those new technologies.

• Lead technical engagements with external vendors and partners to evaluate, co-develop, and qualify next generation packaging processes and components outside of the current standard manufacturing processes.

• Develop and document new process flows and Design-For-Integration (DfI) principles for emerging technologies.
• Investigate and characterize electrical, thermal, and mechanical properties of advanced packaging materials.
  

Minimum qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
  
• 3 years of experience developing advanced packaging solutions.
• 3 years of experience delivering research and development (R&D) concepts to a released product.
• 3 years of experience with one or more of the following technologies: 2.5D/3D integration, wafer-level packaging, panel-level packaging, or hybrid bonding.

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
• Experience using simulation tools to evaluate electrical/RF, thermal, or mechanical performance of packaging structures and guide new designs.
• Experience in a semiconductor packaging environment.
• Familiarity with quantum computing hardware architectures and the specific constraints they impose on packaging design.