Substrate Material and Process Development Engineer

IntelApplyPublished 19 hours agoFirst seen 2 hours ago
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Job Details:

Job Description: 

Are you passionate about pioneering the future of advanced packaging technologies and driving innovation in materials science? Join Intel's cutting-edge team as a Substrate Material and Process Development Engineer, where you'll play a pivotal role in developing revolutionary substrate material, processes that enable Intel's roadmap for next-generation packaging platform technologies. This is your opportunity to work at the forefront of semiconductor innovation, applying novel concepts and innovative solutions that will shape the future of computing.

As a Substrate Material and Process Development Engineer, you will be instrumental in developing Substrate material, process while applying groundbreaking concepts for innovative solutions. You'll optimize manufacturing efficiency, develop processes that meet stringent quality and reliability requirements, and lead efforts in problem-solving and continuous improvement using experimental design and statistical methods. Your expertise will directly contribute to Intel's mission of delivering world-class packaging technologies.

Why Join Us? This is your chance to be part of a team that's revolutionizing semiconductor packaging technologies and making a global impact. You'll work with cutting-edge materials and processes while collaborating with world-class engineers to solve tomorrow's challenges today. Ready to shape the future of advanced packaging? Apply now and join our mission to drive innovation in materials science and process development!

Key Responsibilities:

  • Define substrate materials roadmap to enable leading edge packaging technologies.

  • Develop material and process specifications applying principles of design of experiments and data analysis and document improvements through white papers.

  • Work with material vendor for new material development to meet Intel process capability and performance target.

  • Innovate new process concepts and validate process flow for HVM applications.

  • Qualify new materials and processes with comprehensive characterization plans

  • Optimize and improve the efficiency of manufacturing of packages, developing material/processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements

  • Drive continuous improvement projects and problem-solving efforts

  • Collaborate with cross-functional teams throughout all project phases

  • Provide excellent communication

  • Skills to navigate uncertainties

  • Ability to work in a matrixed environment with smooth stakeholder interactions

  • Responsible and commitment with a can-do attitude

  • Travel and flexibility to meet business needs

Qualifications:

You must possess the below minimum requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Requirements listed can be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

  • Bachelor's with 6 years of experience or Master's degree in 4 years of experience or PhD with 2+ years of relevant experience in Polymer Science and Engineering, polymer physics, Materials Science, Chemical Engineering, or related science and engineering fields.

  • 2+ years of experience in polymer synthesis or advanced packaging and assembly processes

Preferred Qualifications:

  • 4+ years of experience in polymer synthesis, materials development, and materials science fundamentals

  • 4+ years of advanced packaging and assembly process experience

  • Materials characterization skills (SEM, FTIR, TMA, DMA, DSC, TGA, SIMS, mechanical testing)

  • Experience in tool and process PCS, data analysis, statistical tools and methods

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.