Hardware Product Engineer
Description
This role is for a highly technical Directly Responsible Individual (DRI) who leads the end-to-end lifecycle of semiconductor based display —from initial silicon bring-up and characterization to high-volume manufacturing (HVM). You will integrate hardware expertise in relevant fields (such as semiconductor devices, EE, displays) with advanced data analytics to drive product success.
Responsibilities
Lead the transition of products from design to high-volume manufacturing (HVM). Collaborate with design teams to ensure Design for Test (DFT) and Design for Manufacturing (DFM) requirements are met Monitor and analyze wafer sort and final test data. Use statistical methods (Gage R&R, SPC) to identify root causes of yield loss and implement corrective actions Collaborate with system design, packaging, and process teams to resolve integration, reliability, and performance challenges in early-stage prototypes and production systems Create and perform DoEs to uncover device issues' root cause, propose remedy, get alignment from cross functional partners, and execute to their implementation Collaborate with Test Engineering to optimize test programs and test methods to reduce test time without compromising quality or coverage Drive the validation of key performance indicators of integrated display solutions under nominal and corner-case operating conditions Perform analysis electrical characterization across process corners, voltage, and temperature (PVT) to define datasheet specifications Define and execute reliability and qualification test plans for new display technologies in accordance with relevant industry standards and technology requirements Drive root cause investigation of internal and customer returns. Interface with the failure analysis lab to interpret SEM, EDX, or EMMI results Manage technical relationships with OSAT (Out-Sourced Assembly and Test), CM (Contract Manufacturing), and foundries to ensure manufacturing consistency Define and create data pipelines and dashboards for commonly referenced metrics and KPIs facilitate the democratization of data to cross functional teams
Qualifications
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or equivalent experience 8+ years of experience in semiconductor test engineering, product engineering, reliability/qualification (REL / QUAL), process engineering, or advanced integration and packaging Experience with analog and digital circuit test development and optical/electrical measurement techniques Experience with reliability and qualification standards relevant to displays and semiconductor components (JEITA, JEDEC, etc.) Experience leading cross-functional test engineering, device integration, or REL/QUAL projects Experienced in programming languages and algorithms such as Python Ph.D. or M.S. in Electrical Engineering, Materials Science, Physics, or Analytics 10–20+ years of industrial experience in hardware engineering, with a proven history of leading successful NPI programs at major technology companies Experience with III-V material physics, especially LEDs and microLEDs Expertise in advanced semiconductor packaging technologies such as CoWoS, wafer reconstitution, InFO, or Hybrid Bonding Experience applying Machine Learning algorithms to hardware performance and reliability data Proficient in data analysis and reporting tools such as JMP or R Experience building and maintaining automated data pipelines and visualization dashboards (Grafana, Tableau) Experience in yield analysis, process optimization, or failure analysis for display products ATE Test Engineering experience
Compensation: $173,000/year to $245,000/year + bonus + equity + benefits