Senior Microelectronics Numerical Simulation Engineer, Google Cloud
Google's custom-designed hardware is the foundation of one of the largest and most powerful computing infrastructures in the world. Our Global Hardware Quality and Reliability team ensures this infrastructure meets the highest standards of quality and reliability predictability. We underpin Google Technical Infrastructure’s (TI) entire product portfolio—from its Cloud TPU/GPU AI platforms to its core compute, storage, and networking backbone.
As a Microelectronics Numerical Simulation Engineer, you will drive the technology evaluation and simulation capability of our fast-evolving AI platforms, which feature some of the industry's largest and most complex chip packages. By providing design guidelines, virtual prototyping through advanced simulation, risk assessments and material/geometry recommendation, you will influence product architecture from its earliest stages, ensuring its thermomechanical reliability and manufacturability. Your work directly enables Google Cloud to innovate with confidence, accelerate time-to-market, and deliver reliable, high-performance products.
You will be part of the resident Subject Matter Experts (SMEs) in advanced numerical analysis for supply chain operations in Google Technical Infrastructure. This serves as a tremendous opportunity to learn and grow in your career while delivering exceptional value to Google Technical Infrastructure.
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
Responsibilities
- Lead the collaboration with key stakeholders internally and externally to develop numerical models to understand manufacturing and reliability tradeoffs.
- Develop scalable numerical models to capture different failure modes and physics phenomena expected during the entire microelectronics device lifecycle: design, testing, assembly, test, field operation.
- Partner with thermal, packaging, test, manufacturing and quality engineers to develop validated simulation-based design guidelines to ensure rapid and reliable deployment of microelectronics assemblies.
- Envision and execute test vehicles to generate experimental data required for model validation and enhancement.
- Participate in the development of roadmaps of materials, models and infrastructure required to scale numerical models in local and cloud based simulation environments. Attend conferences, standards bodies and other industry forums to keep abreast of the latest developments in numerical analysis.
Minimum qualifications:
- Bachelor's degree in Mechanical Engineering, or equivalent practical experience.
- 8 years of experience in microelectronics packaging.
Preferred qualifications:
- Experience with statistical software tools, computational fluid dynamics, Flotherm, Abaqus, Matlab, and Python.
- Experience with test vehicle design and experimental validation of simulation models.
- Experience in thermomechanical and mechanical shock simulation.
- Experience working in cross-functional engineering teams.
- Proficiency in Finite Element Analysis (FEA) using ANSYS (e.g., APDL, Workbench, Icepak).
- Ability to perform risk assessments based on failure data.