SoC Packaging Engineer

Apple•Apply•Published 2 months ago•First seen 1 months ago

Summary

At Apple, we believe our products begin with our people. By hiring a team with varied strengths, we drive creative thought. By giving that team everything they need, we drive innovation. By hiring incredible engineers, we drive precision. And through our collaborative process, we build memorable experiences for our customers.

These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Will you help us design the next generation of revolutionary Apple products?

Description

We are looking for a senior level IC packaging engineer to develop exciting new products. Your role is to interface between internal product/device design, quality, supply chain, and the external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.

Responsibilities

Explore and evaluate packaging technologies as our own packaging tool box. Define new package characteristics and specification based on unique module and system level performance, cost, and footprint.
Work with foundry, assembly OSAT and material suppliers on advanced organic interconnect package development and perform material selection and characterization based on design, performance, process and reliability requirements.
Deep dive to material characteristics (raw material ingredients, chemical reactions and mechanical properties) and identify key attributes to modulate material properties to meet development requirement or during trouble-shooting to process, electrical or reliability failure.
Interface and coordinate with other packaging team members to comply with product development/ramp schedule. Deliver package/packaging milestones on time.
At least 5~10% travel to domestic and international locations.

Minimum Qualifications

M.S or Ph.D. degree in materials science, chemistry, chemical engineering or similar disciplines with a minimum of 5 years of experience in IC packaging.
In-depth knowledge in organic materials (polymers, molding compounds, under-fill, thermally conductive adhesive/TIM,..,etc) for large body size MCM package technologies.

Preferred Qualifications

Good understanding to organic package process & material characterization such as micro bump plating, RDL lithography, molding compound and under-fill. Knowledge in HBM integration and reliability characterization, advanced silicon node BEOL and device physics or component/board level reliability testing are plus.
Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at internal or external meetings.

Apple is an equal opportunity employer that is committed to inclusion and diversity, and thus we treat all applicants fairly and equally. Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.