Silicon Reliability Engineer

Description

Reality Labs is focused on ensuring the highest quality and reliability of our advanced silicon products. We are seeking a Lead Silicon Reliability Engineer to drive reliability strategies and lead efforts to deliver robust silicon solutions.

Responsibilities

Lead the development, execution, and continuous improvement of silicon reliability qualification strategies aligned with industry standards and customer requirements Act as the technical authority, holding in-depth subject-matter knowledge for silicon reliability across the organization Collaborate with suppliers, product engineering, design, packaging, process, and test teams to influence design-for-reliability early in product development Work with development partners and OSATs to align qualification methodologies and reliability expectations Define and oversee reliability test plans including HTOL, HAST, TC, HTS, EM, TDDB, NBTI, and other stress tests Lead failure analysis and root cause investigations using advanced tools such as TEM, SEM, FIB, and EMMI Work with suppliers to ensure complete and accurate documentation of reliability test plans, procedures, and reports Contribute to internal training and knowledge sharing

Qualifications

M.S. in Electrical Engineering, Materials Science, Physics, or related field with 8+ years of relevant work experience Proven leadership in silicon reliability for high-volume consumer, automotive, or high-performance computing products Demonstrated understanding of CMOS device physics, aging mechanisms (NBTI, HCI, TDDB), failure analysis techniques, and reliability modeling In-depth knowledge of JEDEC and other relevant industry standards Hands-on experience with statistical data analysis tools Proven communication and leadership skills in influencing cross-functional teams and upper management 15+ years of experience in semiconductor reliability engineering, with a focus on advanced silicon technologies Experience in semiconductor device physics research and reliability modeling Experience working with foundries (e.g., TSMC, Samsung, Intel) and advanced process nodes (e.g., 5nm, 3nm) Experience in advanced packaging technologies System-in-Package, 3D, 2.5D packaging